产品列表
- 贵金属
- Iron & Iron Alloy Target
- 镍靶及镍合金溅射靶
- Copper & Copper Alloy Target
- Vanadium & Vanadium Alloy Target
- Titanium & Titanium Alloy Target
- Chromium & Chromium Alloy Target
- Aluminum & Aluminum Alloy Target
- Cobalt & Cobalt Alloy Target
- Tantalum & Tantalum Alloy Target
- Niobium & Niobium Alloy Target
- Tin & Tin Alloy Target
- Indium & Indium Alloy Target
- Evaporation Materials
- Ceramic Sputtering Targets
- Ceramic Evaporation Materials
Vanadium Nickel Iron Aluminum (VNiFeAl) Sputtering Target
| 材料类型 | VNiFeAl Target |
|---|---|
| 元素符号 | VNiFeAl |
| 原子量 | 2N5,3N,3N5 |
| 原子序数 | As request |
| 颜色/外形 | Planar,Disc,Rotary etc |
| 热导率 | 1-3week W/m.K |
| 熔点 | Support Customize (°C) |
| 沸点 | Support (°C) |
| 热膨胀系数 | Semiconductors, display panels, optics, solar energy, and functional coatings /K |
产品简介
Vanadium Nickel Iron Aluminum (VNiFeAl) Sputtering Target Description:
Applications of Tungsten-Nickel-Iron-Aluminum Alloy Targets:
Semiconductors and Microelectronics:
Barrier layer materials; metal gates and electrodes
Solar Cells and New Energy:
Back electrode layer; conductive thin film
Aerospace:
Heat-resistant coatings;
High-density protective coatings
Optics and Displays:
Reflective/anti-reflective coatings for laser mirrors, high-end optical lenses, etc.;
Thin-film transistor (TFT) back electrode layer for high-end displays.
Performance Advantages:
Uniform thin film deposition: The uniformity of the alloy target's microstructure directly affects the thin film quality.
Good adhesion: Excellent bonding strength with substrates such as glass and silicon wafers.
Related Sputtering Targets
V2O5 sputtering target
VWTaTi sputtering target
