产品列表
- 贵金属
- Iron & Iron Alloy Target
- 镍靶及镍合金溅射靶
- Copper & Copper Alloy Target
- Vanadium & Vanadium Alloy Target
- Titanium & Titanium Alloy Target
- Chromium & Chromium Alloy Target
- Aluminum & Aluminum Alloy Target
- Cobalt & Cobalt Alloy Target
- Tantalum & Tantalum Alloy Target
- Niobium & Niobium Alloy Target
- Tin & Tin Alloy Target
- Indium & Indium Alloy Target
- Evaporation Materials
- Ceramic Sputtering Targets
- Ceramic Evaporation Materials
Tin Nickel (SnNi) Sputtering Target
| 材料类型 | SnNi Target |
|---|---|
| 元素符号 | SnNi |
| 原子量 | 3N5 |
| 原子序数 | As request |
| 颜色/外形 | Planar |
| 热导率 | 1-3week W/m.K |
| 熔点 | Support Customize (°C) |
| 沸点 | Support (°C) |
| 热膨胀系数 | Semiconductors, display panels, optics, solar energy, and functional coatings /K |
产品简介
Tin Nickel (SnNi) Sputtering Target Description:
Nickel-tin (NiSn) alloy sputtering targets are alloy sputtering targets that combine high hardness,
excellent corrosion resistance, and good electrical conductivity.
The most common type of tin-nickel target. A typical ratio is Ni:Sn ≈ 80:20 (atomic ratio),
at which the film exhibits both good hardness and corrosion resistance.
Targets with different ratios can be customized according to customer requirements,
such as: SnNi 65/35wt%, SnNi 50/50wt%, round targets, square targets, etc.
The films deposited using nickel-tin alloy targets combine high hardness, excellent corrosion resistance,
and good solderability, making them widely used in various industrial fields.
Abrasion-resistant and corrosion-resistant coatings
Electronic components and connectors
Decorative coatings
New energy and battery fields
SnNi35wt%-3N-COA
Related Sputtering Targets
SnAgCu sputtering target
ZnSn sputtering target
Nb3Sn sputtering target
SnO2 sputtering target
