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Copper Nickel (CuNi) Sputtering Target

材料类型	CuNi Target
元素符号	CuNi
原子量	3N,3N5,4N
原子序数	As request
颜色/外形	Planar,Disc,Rotary etc
热导率	1-3week W/m.K
熔点	Support Customize (°C)
沸点	Support (°C)
热膨胀系数	Semiconductors, display panels, optics, solar energy, and functional coatings /K

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产品简介

Copper Nickel (CuNi) Sputtering Target Description:

Copper Nickel (CuNi) sputtering targets are high-performance binary alloy materials, integrating the excellent electrical conductivity, ductility of copper and the good corrosion resistance, magnetic properties of nickel. They are widely used in thin film deposition fields, suitable for preparing functional films with stable conductivity, corrosion resistance and magnetic performance, and are core materials in electronic, automotive, marine and decorative coating fields. Manufactured with advanced powder metallurgy technology, these targets have high density, uniform alloy composition and stable sputtering performance, ensuring efficient and high-quality thin film deposition.

Common Ratio (Core Ratio Information):

CuNi Common Ratio (wt% or at%)	Application Characteristics (Related Uses)
Cu:Ni = 90:10	High copper content, excellent electrical conductivity and ductility, mainly used for preparing conductive thin films in general electronic components (such as connectors, terminals) and decorative coatings. It has good corrosion resistance, suitable for indoor electronic and decorative scenarios.
Cu:Ni = 70:30	Balanced conductivity and corrosion resistance, the most widely used ratio. Suitable for marine electronic components, automotive electronic sensors and anti-corrosion conductive films, resisting moisture and salt spray erosion, ensuring long-term stable operation of devices.
Cu:Ni = 50:50	Enhanced corrosion resistance and magnetic properties, used for preparing magnetic conductive films in precision sensors, electromagnetic shielding layers and marine equipment coatings. It can also be applied to high-temperature resistant electronic components due to its good thermal stability.
Cu:Ni = 30:70	High nickel content, excellent magnetic properties and corrosion resistance, suitable for magnetic thin films in data storage devices, electromagnetic shielding coatings in high-precision electronic equipment, and anti-corrosion layers in harsh industrial environments.

Semiconductor & Microelectronics

Widely used as conductive layers, electromagnetic shielding layers and contact layers in integrated circuits, precision sensors and electronic packaging. Different CuNi ratios are selected according to the conductivity and corrosion resistance requirements of devices, ensuring stable signal transmission and device reliability.

Automotive & Marine Electronics

Applied to deposit anti-corrosion conductive films for automotive sensors, marine electronic components and shipborne equipment. The corrosion resistance of nickel and conductivity of copper effectively prevent device failure caused by moisture, salt spray and other harsh environments.

Magnetic & Electromagnetic Applications

Used for preparing magnetic thin films in data storage devices, electromagnetic shielding coatings in electronic equipment and magnetic sensors. High-nickel CuNi ratios provide excellent magnetic performance, while low-nickel ratios balance conductivity and magnetic properties for multi-functional scenarios.

Decorative & Industrial Coatings

Suitable for preparing decorative coatings on hardware, consumer electronics and architectural parts, with a uniform and bright surface. At the same time, it is used for anti-corrosion coatings on industrial machinery and precision parts, extending equipment service life.

CuNi sputtering targets with different common ratios are compatible with DC and RF magnetron sputtering systems, ensuring stable deposition, uniform film composition and high film quality. They can be customized into various shapes and sizes according to actual application needs, fully meeting the diverse requirements of different fields.

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