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Aluminum (Al) Sputtering Target

材料类型	Al Target
元素符号	Al
原子量	3N,4N,5N,6N
原子序数	As request
颜色/外形	Planar,Disc,Rotary etc
热导率	1-3week W/m.K
熔点	Support Customize (°C)
沸点	Support (°C)
热膨胀系数	Semiconductors, display panels, optics, solar energy, and functional coatings /K

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产品简介

Aluminum (Al) Sputtering Target Description:

Aluminum (Al) sputtering targets are fundamental and widely used metallic materials for depositing high-purity, high-conductivity aluminum thin films across advanced electronic, semiconductor, optical, and industrial applications. With excellent electrical conductivity, good thermal conductivity, strong adhesion, low internal stress, and uniform film formation, pure aluminum targets are the cornerstone for high-quality conductive and protective coatings.

Semiconductor & Microelectronics

Widely used as interconnect layers, contact metallization, and conductive pathways in integrated circuits, wafers, and electronic packaging, ensuring low-resistance signal transmission and device reliability.

Optical & Reflective Coatings

Applied for fabricating high-reflectivity mirror films, optical coatings, and reflective layers in lighting, display, imaging, and solar energy devices.

Protective & Barrier Films

Used to deposit corrosion-resistant, oxidation-resistant, and barrier layers on various substrates, enhancing surface durability and stability in general industrial environments.

Thin-Film Conductors & Electrodes

Suitable for transparent conductive film auxiliary layers, thin-film electrodes, and conductive structures in consumer electronics, sensors, and optoelectronic devices.

Research & Advanced Coating Development

Extensively employed in materials science, thin-film deposition research, and the development of next-generation electronic and optical coating systems.

Aluminum sputtering targets are compatible with DC and RF magnetron sputtering systems, ensuring stable deposition, uniform film thickness, and high-quality thin-film formation.
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