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Aluminum Tin Copper (AlSnCu) Sputtering Target

材料类型	AlSnCu Target
元素符号	AlSnCu
原子量	3N,3N5
原子序数	As request
颜色/外形	Planar,Disc,Rotary etc
热导率	1-3week W/m.K
熔点	Support Customize (°C)
沸点	Support (°C)
热膨胀系数	Semiconductors, display panels, optics, solar energy, and functional coatings /K

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产品简介

Aluminum Tin Copper (AlSnCu) Sputtering Target Description:
Aluminum Tin Copper (AlSnCu) sputtering targets are high-performance ternary alloy materials widely used for depositing high-performance conductive, solderable, and protective thin films in advanced electronic, packaging, and industrial applications. With excellent wettability, electrical conductivity, strong adhesion, low internal stress, and uniform film formation, AlSnCu ternary alloys are ideal for high-reliability electronic interconnect and functional coatings.

Electronic Packaging & Solderable Coatings

AlSnCu targets are commonly used to deposit solderable and bonding layers for electronic components, connectors, and packaging substrates, ensuring excellent weldability and long-term contact stability.

Semiconductor & Microelectronics

Applied as interconnect metallization, contact layers, and barrier coatings in integrated circuits, wafers, and electronic packaging, providing stable electrical performance and interface reliability.

Conductive & Corrosion-Resistant Films

Used for fabricating high-conductivity protective films with good corrosion resistance for automotive electronics, consumer electronics, and precision devices.