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Tantalum Aluminum (TaAl) Sputtering Target

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Aluminum
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Aluminum

Tantalum Aluminum (TaAl) Sputtering Target

材料类型 TaAl Target
元素符号 TaAl 
原子量 3N5
原子序数 As request
颜色/外形 Planar,Disc,Rotary etc
热导率 1-3week W/m.K
熔点 Support Customize (°C)
沸点 Support (°C)
热膨胀系数 Semiconductors, display panels, optics, solar energy, and functional coatings /K
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产品简介

Tantalum Aluminum (TaAl) Sputtering Target Description:

Tantalum Aluminum (TaAl) sputtering targets are high-performance binary alloy materials widely used for depositing high-performance barrier, protective, and high-temperature resistant thin films in advanced electronic, optical, and industrial applications. With excellent oxidation resistance, thermal stability, strong adhesion, low internal stress, and uniform film formation, TaAl binary alloys are ideal for high-durability functional coatings.

Common Ratio TaAl,wt%orat%Application Characteristics
Ta:Al = 90:10High tantalum content, excellent thermal stability and low outgassing; suitable for diffusion barrier layers and high‑temperature protective coatings in semiconductors and electronic packaging.
Ta:Al = 80:20Balanced mechanical strength and processability; widely used for conductive barrier films and adhesion layers in optoelectronic devices and precision coatings.
Ta:Al = 70:30Good ductility and film uniformity; ideal for multi‑layer stack coatings and decorative/protective layers in aerospace and industrial components.
Ta:Al = 60:40Enhanced oxidation resistance and process stability; commonly applied to corrosion‑resistant coatings and high‑performance optical films.
Ta:Al = 50:50Excellent comprehensive performance, including low internal stress and good film density; suitable for semiconductor contact layers and high‑reliability thin‑film encapsulation.
Ta:Al = 40:60High aluminum content, improved ductility and formability; used for flexible electronic films, conductive coatings, and low‑temperature deposition applications.
Ta:Al = 30:70High aluminum content for high conductivity and good adhesion; applied to transparent conductive films and optoelectronic electrode coatings.

High-Temperature Protective Coatings

TaAl targets are commonly used to deposit oxidation and corrosion-resistant layers for cutting tools, engine components, and surface protection under extreme environments.

Semiconductor & Microelectronics

Applied as diffusion barrier layers, encapsulation films, and passivation coatings in integrated circuits, wafers, and electronic packaging.

Optical & Protective Films

Used for fabricating durable optical coatings, anti-reflection films, and hard protective layers with high thermal and mechanical stability.

Thin-Film Encapsulation & Barrier Materials

Suitable for gas barrier films, moisture-resistant coatings, and insulating layers in display and optoelectronic devices.

Research & Advanced Coating Development

Widely used in materials science, thin-film deposition, and high-performance coating research.

TaAl sputtering targets are compatible with DC and RF magnetron sputtering systems, ensuring stable deposition and high-quality thin films.

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