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Ceramic Evaporation Materials


材料类型 Ceramic Materials
元素符号 /
原子量 As request
原子序数 As request
颜色/外形 Pellet,Granules,Lump,Cube
热导率 1-3week W/m.K
熔点 Support Customize (°C)
沸点 Support (°C)
热膨胀系数 Semiconductors, display panels, optics, solar energy, and functional coatings /K
产品简介

We supply a comprehensive range of high-performance ceramic materials designed for precision thin film deposition. Our products are widely used in semiconductor, optics, electronics, energy, and coating industries.

With strict control over purity, density, and microstructure, our ceramic evaporation materials ensure stable sputtering performance, excellent film quality, and long service life.

Available Materials

We offer a broad portfolio of oxide, nitride, carbide, boride, and compound ceramic materials:

Oxide Ceramics

  • SrTiO3 (Strontium Titanate)

  • BaTiO3 (Barium Titanate)

  • Fe2O3 (Iron Oxide)

  • NiO (Nickel Oxide)

  • In2O3 (Indium Oxide)

  • MgO (Magnesium Oxide)

  • Ta2O5 (Tantalum Oxide)

  • Nb2O5 (Niobium Oxide)

  • HfO2 (Hafnium Oxide)

  • Al2O3 (Aluminum Oxide)

  • ZnO (Zinc Oxide)

  • TiO2 (Titanium Dioxide)

  • SiO2 (Silicon Dioxide)

Carbides

  • TaC (Tantalum Carbide)

  • NbC (Niobium Carbide)

  • HfC (Hafnium Carbide)

  • SiC (Silicon Carbide)

Nitrides

  • TaN (Tantalum Nitride)

  • NbN (Niobium Nitride)

  • CrN (Chromium Nitride)

  • TiN (Titanium Nitride)

  • BN (Boron Nitride)

Borides

  • TiB2 (Titanium Diboride)

  • ZrB2 (Zirconium Diboride)

Composite / Special Ceramics

  • B4C (Boron Carbide)

Key Features

  • High Purity: Up to 99.99% for critical applications

  • High Density: ≥ 98% theoretical density for stable sputtering

  • Uniform Microstructure: Ensures consistent film deposition

  • Customizable Sizes: Lump, Granules, Pellets,Cube,etc


The primary application of ceramic evaporation materials is as a core heating element or container in vacuum evaporation 

processes. Through its own electrical conductivity, it heats and melts metals such as aluminum and copper, 

causing them to evaporate and deposit uniformly onto the surface of substrates like plastics, paper, and glass, 

forming an extremely thin metallic film.


Specifically, it mainly serves the coating production in the following fields:


Packaging Materials: Aluminum film is deposited on plastic or paper packaging for food and pharmaceuticals to 

block oxygen and moisture, extending shelf life.


Electronic Components: Used in the manufacture of metallized coatings for capacitors, multilayer capacitors, 

and the metallization of integrated circuits.


Decoration and Anti-counterfeiting: Used in the production of hot stamping film, anti-counterfeiting marks, 

coatings for high-end packaging boxes, and reflective coatings for products such as automotive lights.


Display and Optics: Used in the coating manufacturing of displays.


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