产品列表
- 贵金属
- Iron & Iron Alloy Target
- 镍靶及镍合金溅射靶
- Copper & Copper Alloy Target
- Vanadium & Vanadium Alloy Target
- Titanium & Titanium Alloy Target
- Chromium & Chromium Alloy Target
- Aluminum & Aluminum Alloy Target
- Cobalt & Cobalt Alloy Target
- Tantalum & Tantalum Alloy Target
- Niobium & Niobium Alloy Target
- Tin & Tin Alloy Target
- Indium & Indium Alloy Target
- Evaporation Materials
- Ceramic Sputtering Targets
- Ceramic Evaporation Materials
Indium (In) Pellets
| 材料类型 | In Pellets |
|---|---|
| 元素符号 | In |
| 原子量 | 4N,4N5,5N,6N,7N |
| 原子序数 | As request |
| 颜色/外形 | Pellet,Granules,Bead,Lump |
| 热导率 | 1-3week W/m.K |
| 熔点 | Support Customize (°C) |
| 沸点 | Support (°C) |
| 热膨胀系数 | Semiconductors, display panels, optics, solar energy, and functional coatings /K |
产品简介
Indium (In) Pellets Description:
The core application of indium (In) particles and evaporation materials is to utilize its high thermal conductivity,
low melting point, excellent electrical conductivity, and good wettability to form functional thin films on
various substrates through processes such as vacuum evaporation.
Purity: 4N,4N5,5N,6N,7N
Size: 1-10mm, 1-20mm , 1-5mm, 0.5kg ingot, 1kg ingot ,Customize Size
Shape: Granules,Beads,Pellets,Lump; Ingot; Customize Shape
Application:
These thin films play an irreplaceable role in high-end manufacturing, particularly in semiconductor packaging and
optoelectronic displays. The following are their main applications:
Semiconductors and Microelectronics
1. Thermal Interface Material (TIM1): Used for efficient heat conduction between high-performance chips such
as CPUs and GPUs and heat sinks.
2. Chip Packaging Interconnect: Used as solder to achieve low-temperature, high-reliability electrical interconnection
between chips and substrates.
Optoelectronics and Displays
1. Transparent Conductive Film: Used to manufacture ITO (Indium Tin Oxide) thin films, a core electrode material for LCDs,
touchscreens, and OLEDs.
2. Optical Thin Film: Used in high-end optical devices such as filters and antireflective coatings.
New Energy and Electronic Devices
Special Alloys and Coatings
1. Low-Temperature Solder: Used to manufacture heat-sensitive welding alloys.
2. Wear-Resistant/Antistatic Coating: Used as an additive to improve the wear resistance and antistatic properties of materials.
In-5N-COA








