产品列表
- 贵金属
- Iron & Iron Alloy Target
- 镍靶及镍合金溅射靶
- Copper & Copper Alloy Target
- Vanadium & Vanadium Alloy Target
- Titanium & Titanium Alloy Target
- Chromium & Chromium Alloy Target
- Aluminum & Aluminum Alloy Target
- Cobalt & Cobalt Alloy Target
- Tantalum & Tantalum Alloy Target
- Niobium & Niobium Alloy Target
- Tin & Tin Alloy Target
- Indium & Indium Alloy Target
- Evaporation Materials
- Ceramic Sputtering Targets
- Ceramic Evaporation Materials
Tantalum (Ta) Sputtering Target
| 材料类型 | Ta Target |
|---|---|
| 元素符号 | Ta |
| 原子量 | 3N5,4N |
| 原子序数 | As request |
| 颜色/外形 | Planar,Disc,Rotary etc |
| 热导率 | 1-3week W/m.K |
| 熔点 | Support Customize (°C) |
| 沸点 | Support (°C) |
| 热膨胀系数 | Semiconductors, display panels, optics, solar energy, and functional coatings /K |
产品简介
Tantalum (Ta) Sputtering Target Description:
Tantalum (Ta) sputtering targets are high-purity metallic materials, mainly used for depositing high-performance tantalum thin films with excellent chemical inertness, high melting point, and good electrical conductivity. The purity of the target is 3N5-4N (99.95%-99.99%), which can meet the requirements of different precision sputtering applications and ensure the stability and reliability of the deposited thin films.
Semiconductor & Microelectronics
High-Temperature Protective Coatings
Corrosion-Resistant Applications
Optical & Optoelectronic Devices
Research & Development
Related Sputtering Targets
TaAl Sputtering Target
TaW Sputtering Target
TaNb Sputtering Target
TaMo Sputtering Target
TaTi Sputtering Target
Ta Sputtering Target







