产品列表
- 贵金属
- Iron & Iron Alloy Target
- 镍靶及镍合金溅射靶
- Copper & Copper Alloy Target
- Vanadium & Vanadium Alloy Target
- Titanium & Titanium Alloy Target
- Chromium & Chromium Alloy Target
- Aluminum & Aluminum Alloy Target
- Cobalt & Cobalt Alloy Target
- Tantalum & Tantalum Alloy Target
- Niobium & Niobium Alloy Target
- Tin & Tin Alloy Target
- Indium & Indium Alloy Target
- Evaporation Materials
- Ceramic Sputtering Targets
- Ceramic Evaporation Materials
Tin Copper (SnCu) Sputtering Target
| 材料类型 | SnCu Target |
|---|---|
| 元素符号 | SnCu |
| 原子量 | 3N,3N5 |
| 原子序数 | As request |
| 颜色/外形 | Planar |
| 热导率 | 1-3week W/m.K |
| 熔点 | Support Customize (°C) |
| 沸点 | Support (°C) |
| 热膨胀系数 | Semiconductors, display panels, optics, solar energy, and functional coatings /K |
产品简介
Tin Copper (SnCu) Sputtering Target Description:
Tin-copper alloy sputtering targets are an important type of alloy sputtering target,
with their core properties determined by the tin (Sn) content.
Common ratio classifications:
SnCu 10wt%
SnCu 39wt%
SnCu 40wt%
SnCu 50wt% The purity is typically 99.9% (3N), used for general industrial coatings such as decoration and tools.
Higher purity, reaching 99.99% (4N) or even higher (e.g., 5N), with extremely strict impurity control, is used in semiconductor,
precision optics, and other fields with stringent thin film quality requirements.
Tin-copper alloy sputtering targets have a wide range of applications, covering many high-tech fields.
The films deposited by sputtering exhibit good conductivity, excellent wear resistance, and corrosion resistance, including:
Electronics and Information Industry
Semiconductor and Photovoltaic Fields
Optical Coating
Glass Coating and Functional Coating
Decorative and Surface Modification
AlSnCu-4N-COA
Related Sputtering Materials
SnAgCu sputtering target
ZnSn sputtering target
Nb3Sn sputtering target
SnO2 sputtering target
