产品列表
- 贵金属
- Iron & Iron Alloy Target
- 镍靶及镍合金溅射靶
- Copper & Copper Alloy Target
- Vanadium & Vanadium Alloy Target
- Titanium & Titanium Alloy Target
- Chromium & Chromium Alloy Target
- Aluminum & Aluminum Alloy Target
- Cobalt & Cobalt Alloy Target
- Tantalum & Tantalum Alloy Target
- Niobium & Niobium Alloy Target
- Tin & Tin Alloy Target
- Indium & Indium Alloy Target
- Evaporation Materials
- Ceramic Sputtering Targets
- Ceramic Evaporation Materials
Copper Boron (CuB) Sputtering Target
| 材料类型 | CuB Target |
|---|---|
| 元素符号 | CuB |
| 原子量 | 3N,3N5 |
| 原子序数 | As request |
| 颜色/外形 | Planar,Disc,Rotary etc |
| 热导率 | 1-3week W/m.K |
| 熔点 | Support Customize (°C) |
| 沸点 | Support (°C) |
| 热膨胀系数 | Semiconductors, display panels, optics, solar energy, and functional coatings /K |
产品简介
Copper Boron (CuB) Sputtering Target Description:
Copper Boron (CuB) Sputtering Target
Copper Boron (CuB) sputtering targets are high-performance alloy materials, integrating the excellent electrical conductivity, ductility of copper and the high hardness, corrosion resistance of boron. They are widely used in thin film deposition fields, suitable for preparing functional films with high conductivity, wear resistance and high temperature resistance, and are core materials in electronic, industrial and scientific research fields.
CuB Alloy Ratio (Core Ratio Information):
CuB Alloy Ratio | Application Characteristics |
Cu:B = 95:5 | Most commonly used conventional ratio, suitable for general industrial and electronic applications (such as common conductive films, decorative coatings). It balances conductivity and hardness, with stable sputtering performance and high cost-effectiveness, meeting basic application needs. |
Cu:B = 90:10 | High copper content, excellent electrical conductivity, suitable for mid-to-high-end electronic and optoelectronic applications (such as semiconductor auxiliary conductive layers, optoelectronic device electrodes). It effectively ensures stable film formation and low impurity interference. |
Cu:B = 85:15 | High boron content, enhanced hardness and corrosion resistance, suitable for precision industrial coatings, cutting tools and high-temperature application scenarios, ensuring good wear resistance and stability. |
Semiconductor & Microelectronics
Widely used as conductive layers, interconnection lines and diffusion barrier auxiliary layers in integrated circuits, wafers and electronic packaging, leveraging the good conductivity of copper and the stability of boron to ensure the stable operation of electronic devices.
Optoelectronic & Display Devices
Applied to deposit functional thin films for displays, solar cells and optoelectronic sensors, improving the conductivity and wear resistance of devices, and enhancing the service life and stability of products.
Industrial Protective Coatings
Suitable for preparing wear-resistant, corrosion-resistant and high-temperature resistant coatings, applied to industrial machinery, precision parts and other fields, effectively extending the service life of equipment.
Scientific Research & Other Applications
Widely used in materials science research, thin film deposition experiments and special functional material preparation, meeting the high requirements of cutting-edge research and special industrial fields.
CuB sputtering targets with different ratios are compatible with DC and RF magnetron sputtering systems, ensuring stable deposition, uniform film thickness and high film quality, which can fully meet the application needs of different fields.
Related Sputtering Targets
CuAl Sputtering Target
CuB Sputtering Target
CuCr Sputtering Target
CuNi Sputtering Target







