产品列表
- 贵金属
- Iron & Iron Alloy Target
- 镍靶及镍合金溅射靶
- Copper & Copper Alloy Target
- Vanadium & Vanadium Alloy Target
- Titanium & Titanium Alloy Target
- Chromium & Chromium Alloy Target
- Aluminum & Aluminum Alloy Target
- Cobalt & Cobalt Alloy Target
- Tantalum & Tantalum Alloy Target
- Niobium & Niobium Alloy Target
- Tin & Tin Alloy Target
- Indium & Indium Alloy Target
- Evaporation Materials
- Ceramic Sputtering Targets
- Ceramic Evaporation Materials
Copper Aluminum (CuAl) Sputtering Target
| 材料类型 | CuAl Target |
|---|---|
| 元素符号 | CuAl |
| 原子量 | 3N,3N5 |
| 原子序数 | As request |
| 颜色/外形 | Planar,Disc,Rotary etc |
| 热导率 | 1-3week W/m.K |
| 熔点 | Support Customize (°C) |
| 沸点 | Support (°C) |
| 热膨胀系数 | Semiconductors, display panels, optics, solar energy, and functional coatings /K |
产品简介
Copper Aluminum (CuAl) Sputtering Target Description:
Copper Aluminum (CuAl) sputtering targets are high-performance binary alloy materials renowned for their excellent thermal conductivity, corrosion resistance, and mechanical processability. By integrating the high ductility and conductivity of copper with the high hardness and oxidation resistance of aluminum, they are widely utilized in thin film deposition for electronic packaging, heat dissipation components, and decorative coating applications. Manufactured via advanced vacuum melting and hot isostatic pressing (HIP) techniques, these targets feature a dense and uniform microstructure, ensuring stable sputtering performance and high-quality film formation.
Common Ratio
| CuAl Common Ratio (wt% or at%) | Application Characteristics (Related Uses) |
|---|---|
| Cu:Al = 95:5 | High copper content; primarily used for conductive layers and adhesion promoters in semiconductor packaging and flexible printed circuits (FPCs), ensuring reliable signal transmission. |
| Cu:Al = 90:10 | Balanced performance; widely applied to wear-resistant and anti-corrosion coatings on electronic connectors, terminals, and precision hardware components. |
| Cu:Al = 80:20 | Enhanced hardness and formability; ideal for heat dissipation films in LED lighting and power electronics, as well as decorative layers on consumer electronics. |
| Cu:Al = 70:30 | High aluminum content; suitable for high-temperature resistant coatings and brazing filler metal layers, providing excellent oxidation and wear resistance. |
Key Applications
Semiconductor & Microelectronics
Serve as diffusion barrier layers, thermal interface materials (TIMs), and bonding layers in integrated circuits (ICs) and wafer-level packaging (WLP), effectively improving device reliability and heat dissipation efficiency.
Automotive & Electronics
Deposited for sensor components, connector coatings, and heat sink layers in automotive electronics, resisting high temperatures, vibration, and harsh environmental conditions.
Decorative & Industrial Coatings
Applied to hardware fixtures, automotive parts, and architectural components for a uniform, bright metallic finish. Additionally, used for anti-fingerprint and wear-resistant surface treatments on high-end electronic devices.
Compatibility
CuAl sputtering targets are fully compatible with DC and RF magnetron sputtering systems, ensuring stable deposition, uniform film composition, and consistent performance across a wide range of process conditions. They can be customized into various shapes and sizes (e.g., round, square, custom blocks) to meet the specific requirements of different applications.
Related Sputtering Targets
CuAl Sputtering Target
CuB Sputtering Target
CuCr Sputtering Target
CuNi Sputtering Target
